• DocumentCode
    569882
  • Title

    Method for calculation of contact resistance and finite element simulation of contact temperature rise based on rough surface contact model

  • Author

    Wang Shujuan ; Hu Fang ; Su Bonan ; Zhai Guofu

  • Author_Institution
    Sch. of Electr. Eng. & Autom., Harbin Inst. of Technol., Harbin, China
  • fYear
    2012
  • fDate
    14-17 May 2012
  • Firstpage
    317
  • Lastpage
    321
  • Abstract
    Calculation of contact resistance is closely related to the accuracy of switches´ thermal simulation, though this issue is still in lack of effective method until now. This paper presented a new method for accurate acquirement of contact resistance and temperature rise based on rough surface contact model and finite element simulation. The relation between contact resistance and contact force was developed with the surface profile and the separation between reference planes of contacting surfaces. An equivalent contact model was built with the separation and real contact area in 3-D thermal-electrical coupled finite element simulation to acquire contact temperature rise. Experiments were conducted to verify this method. The research would provide an accurate and effective method for calculation of contact resistance and simulation of contact temperature rise.
  • Keywords
    contact resistance; finite element analysis; 3D thermal-electrical coupled finite element simulation; contact force; contact resistance calculation; contact temperature; equivalent contact model; rough surface contact model; switches thermal simulation; temperature rise; contact model; contact resistance; contact temperature rise; finite element simulation;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Electrical Contacts (ICEC 2012), 26th International Conference on
  • Conference_Location
    Beijing
  • Electronic_ISBN
    978-1-84919-508-9
  • Type

    conf

  • DOI
    10.1049/cp.2012.0668
  • Filename
    6301913