• DocumentCode
    569884
  • Title

    Constriction current behavior of oxide film effect observed by using LED wafer

  • Author

    Sawada, Syo ; Tsukiji, Shigeki ; Tamai, Terutaka ; Hattori, Yoshiyuki

  • Author_Institution
    Grad. Sch. of Eng., Mie Univ., Tsu, Japan
  • fYear
    2012
  • fDate
    14-17 May 2012
  • Firstpage
    326
  • Lastpage
    330
  • Abstract
    In order to clarify the theory of contact resistance, there are many reports in these years. Mathematically the constriction current is derived from Laplace equation at one contact which shape is circle, ellipse, triangle and square. And numerical approach for constriction current analysis was also preformed by Minowa and Sawada. Although there are many reports on the contact resistance measurement, not many reports on the detailed behavior of current density distribution in the contact area experimentally. Therefore, we attempted to observe the behavior of the current density distribution in the contact by using semiconductor wafers. As a result, it was confirmed that electric current is uniformly distributed over the contact area covered by an oxide film, while it is concentrated at the periphery of the contact if there is no oxide film at contact. And the contact resistance of apparent contact area is almost same as real contact area which is also agree with the theory of multi-spot contact. Moreover, the contact resistance is influenced by wafer thickness.
  • Keywords
    Laplace equations; contact resistance; current density; electric resistance measurement; electrical contacts; light emitting diodes; LED wafer; Laplace equation; apparent contact area; constriction current analysis; contact resistance measurement; current density distribution; electric current; multispot contact; oxide film effect; semiconductor wafers; Constriction Resistance; Contact Resistance; Current Constriction; Current Density Distribution; Direct observation; Electrical Contact; Light Emitting Diode;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Electrical Contacts (ICEC 2012), 26th International Conference on
  • Conference_Location
    Beijing
  • Electronic_ISBN
    978-1-84919-508-9
  • Type

    conf

  • DOI
    10.1049/cp.2012.0670
  • Filename
    6301915