DocumentCode
570402
Title
TNB IEC 61850 System Verification and Simulation (SVS) laboratory: Enabler to a successful smart grid implementation
Author
Ridwan, M.I. ; Zarmani, M.H. ; Lajim, R.M. ; Musa, A.
Author_Institution
TNB Res. Sdn Bhd, Malaysia
fYear
2012
fDate
21-24 May 2012
Firstpage
1
Lastpage
6
Abstract
IEC 61850 is an international standard for electrical substation automation that will significantly improve the design and construction of electrical power systems in the future. In 2010, the United States National Institute of Standards and Technologies (NIST) has recognized IEC 61850 as one of the key enablers for Smart Grid implementation. As the public electric utility company in Malaysia, Tenaga Nasional Berhad (TNB) is fully aware of the potential and capabilities of the IEC 61850 standard in a Smart Grid environment. To ensure the successful implementation of IEC 61850 standard, TNB has developed the System Verification and Simulation (SVS) laboratory to simulate and verify systems and devices related to IEC 61850, before actual implementation in substations. This paper will discuss the features, components and capabilities of the TNB IEC 61850 SVS laboratory.
Keywords
electricity supply industry; laboratory techniques; power engineering computing; smart power grids; substation automation; Malaysian public electric utility company; NIST; TNB IEC 61850 SVS laboratory; TNB IEC 61850 system verification and simulation laboratory; Tenaga Nasional Berhad; United States National Institute of Standards and Technologies; electrical power system construction improvement; electrical power system design improvement; electrical substation automation; smart grid implementation; IEC standards; Laboratories; Smart grids; Substation automation; Automation and Control System (SPACS); IEC 61850; Intelligent Electronic Devices (IEDs); Smart Grid; Smart Substation; Substation Protection; System Verification and Simulation (SVS) Laboratory;
fLanguage
English
Publisher
ieee
Conference_Titel
Innovative Smart Grid Technologies - Asia (ISGT Asia), 2012 IEEE
Conference_Location
Tianjin
Print_ISBN
978-1-4673-1221-9
Type
conf
DOI
10.1109/ISGT-Asia.2012.6303225
Filename
6303225
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