DocumentCode
571789
Title
Analysis of transcutaneous inductive powering links
Author
Mutashar, S. ; Hannan, M.A. ; Samad, Salina Abdul ; Hussain, Amir
Author_Institution
Dept. of Electr., Electron. & Syst. Eng., Univ. Kebangsaan Malaysia, Bangi, Malaysia
Volume
1
fYear
2012
fDate
12-14 June 2012
Firstpage
64
Lastpage
67
Abstract
Inductive coupling link is widely used in transcutaneous power transmission to transfer data and power to the implanted biomedical devices such as implanted micro-sensor system. The inductive coupling variables play a strong rule in coupling efficiency. In this paper the coupling link variables is investigated and analyzed. The resonant frequency 13.56 MHz was used according to industrial, scientific and medical (ISM) band. Results show that the voltage gain Vgain of the inductive links is depended of coupling factor K and resistive load Rload (implanted device). The voltage gain increase with increasing the implanted resistance with constant K. Simulation show that when Rload=400Ω, the Vgain will be in maximum value, and when Rload=200Ω, the Vgain will be in minimum value and approximately 4v. With these results, the system operation is satisfied the requirement of the implanted devices power. Theoretical and simulation is done using software OrCAD-P spice 16.2.
Keywords
inductive power transmission; prosthetic power supplies; coupling efficiency; coupling factor; data transfer; frequency 13.56 MHz; implanted biomedical devices; implanted device resistive load; implanted microsensor system; inductive coupling link; inductive link voltage gain; power transfer; resistance 200 ohm; resistance 400 ohm; transcutaneous inductive powering links; transcutaneous power transmission; Coils; Couplings; Immune system; Implants; Inductance; Resistance; Resonant frequency; Biomedical implanted devices; Low band frequency (ISM); energy harvesting; inductive coupling links;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent and Advanced Systems (ICIAS), 2012 4th International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4577-1968-4
Type
conf
DOI
10.1109/ICIAS.2012.6306160
Filename
6306160
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