• DocumentCode
    571789
  • Title

    Analysis of transcutaneous inductive powering links

  • Author

    Mutashar, S. ; Hannan, M.A. ; Samad, Salina Abdul ; Hussain, Amir

  • Author_Institution
    Dept. of Electr., Electron. & Syst. Eng., Univ. Kebangsaan Malaysia, Bangi, Malaysia
  • Volume
    1
  • fYear
    2012
  • fDate
    12-14 June 2012
  • Firstpage
    64
  • Lastpage
    67
  • Abstract
    Inductive coupling link is widely used in transcutaneous power transmission to transfer data and power to the implanted biomedical devices such as implanted micro-sensor system. The inductive coupling variables play a strong rule in coupling efficiency. In this paper the coupling link variables is investigated and analyzed. The resonant frequency 13.56 MHz was used according to industrial, scientific and medical (ISM) band. Results show that the voltage gain Vgain of the inductive links is depended of coupling factor K and resistive load Rload (implanted device). The voltage gain increase with increasing the implanted resistance with constant K. Simulation show that when Rload=400Ω, the Vgain will be in maximum value, and when Rload=200Ω, the Vgain will be in minimum value and approximately 4v. With these results, the system operation is satisfied the requirement of the implanted devices power. Theoretical and simulation is done using software OrCAD-P spice 16.2.
  • Keywords
    inductive power transmission; prosthetic power supplies; coupling efficiency; coupling factor; data transfer; frequency 13.56 MHz; implanted biomedical devices; implanted device resistive load; implanted microsensor system; inductive coupling link; inductive link voltage gain; power transfer; resistance 200 ohm; resistance 400 ohm; transcutaneous inductive powering links; transcutaneous power transmission; Coils; Couplings; Immune system; Implants; Inductance; Resistance; Resonant frequency; Biomedical implanted devices; Low band frequency (ISM); energy harvesting; inductive coupling links;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent and Advanced Systems (ICIAS), 2012 4th International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4577-1968-4
  • Type

    conf

  • DOI
    10.1109/ICIAS.2012.6306160
  • Filename
    6306160