Copper wirebond package decapsulation technique using mixed acid chemistry

Author

Ng, Soo Whye ; Zhang, Hong Bo ; Liew, Kaeng Nan ; Lee, Wilson ; De Lin, Ren

Author_Institution

United Microelectron. Corp. Ltd., Singapore, Singapore

fYear

2012

fDate

2-6 July 2012

Firstpage

1

Lastpage

5

Abstract

Copper (Cu) wirebond technology in IC packaging has become popular these days due to its better characteristic and cost compare to Gold (Au). Nonetheless, failure analysis remains to be very challenging as Cu is easily dissolved when it is reacted with fuming nitric acid used during standard decapsulation process. Hence, by utilizing enhanced manual decapsulation technique with mixture of fuming nitric acid and concentrated sulfuric acid at low temperature, successful Cu wire package decapsulation happen to be reproducible mainly for die level failure analysis purposes.

Keywords

copper; failure analysis; integrated circuit packaging; lead bonding; IC packaging; concentrated sulfuric acid; copper wirebond package decapsulation; die level failure analysis; enhanced manual decapsulation technique; fuming nitric acid; mixed acid chemistry; standard decapsulation process; Chemicals; Copper; Corrosion; Electric variables; Etching; Plasma temperature; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the

Conference_Location

Singapore

ISSN

1946-1542

Print_ISBN

978-1-4673-0980-6

Type

conf

DOI

10.1109/IPFA.2012.6306250

Filename

6306250