• DocumentCode
    571859
  • Title

    Alternative FIB cross section and laser ablation methods to improve failure analysis throughput of copper wire moisture related reliability failures

  • Author

    Kho, W.F. ; Leow, J.L. ; Cheah, Y.C. ; Cheah, Y.W.

  • Author_Institution
    Free Ind. Zone Sungei Way, Freescale Semicond. Malaysia, Petaling Jaya, Malaysia
  • fYear
    2012
  • fDate
    2-6 July 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In analysis of copper wire moisture related reliability failures long hours are spent on the FIB tool. Two techniques are introduced to reduce the long analysis time: 1) An alternative FIB trenching method that reduces milling duration by 5X and, 2) A “FIB-free” approach using laser ablation.
  • Keywords
    copper; failure analysis; laser ablation; wires (electric); FIB tool; alternative FIB cross section; alternative FIB trenching; analysis time; copper wire moisture related reliability failures; failure analysis throughput; laser ablation; milling duration; Compounds; Copper; Laser ablation; Materials; Milling; Moisture; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
  • Conference_Location
    Singapore
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4673-0980-6
  • Type

    conf

  • DOI
    10.1109/IPFA.2012.6306278
  • Filename
    6306278
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=571859