Title :
The Auger chemical state analysis on leadframe surface contamination
Author :
Zakaria, Nurhanani
Author_Institution :
Infineon Technologies (Kulim) Sdn.Bhd., Lot 10 & 11, Industrial Zone Phase II, Kulim Hi-Tech Park, 09000, Kedah, Malaysia
Abstract :
This paper discusses applications of Auger Electron Spectroscopy (AES) chemical state analysis to analyze the wirebond non-stick on leadframe (NSOL) issue. Results showed higher oxidation level for problematic leafdrame which revealed presence of Zinc Oxide and Chromium Oxide.
Keywords :
IEEE Xplore; Portable document format;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306317
