Title :
The correlation of performance in CdTe photovoltaics with grain boundaries
Author :
Nowell, M.M. ; Wright, S.I. ; Scarpulla, M.A. ; Compaan, A.D. ; Liuc, X. ; Paudel, N.R. ; Wieland, K.A.
Author_Institution :
EDAX, Draper, UT, USA
Abstract :
It is assumed that the performance of polycrystalline CdTe photovoltaic thin films is correlated to microstructure, especially aspects of the microstructure related to grain boundaries. However the role of grain boundaries on the electrical performance of these films is not well understood. In an effort to gain understanding into the correlation between the performance and grain boundaries in CdTe thin films, electron backscatter diffraction (EBSD) has been used to characterize the the grain size, grain boundary structure and texture of sputtered CdTe at varying deposition pressures before and after CdCl2 treatment. Weak axisymmetric (or fiber) textures were observed in the as-deposited films. At lower deposition pressures (111) fiber textures were observed and (110) fiber textures were observed at higher lower deposition pressures. Samples treated with CdCl2 exhibited significant grain growth with a high fraction of twin boundaries. A much stronger correlation of performance with grain size was found when the grain size was corrected to exclude the twin boundaries. This observation confirms that the twin boundaries do indeed have different electrical properties than random high-angle boundaries.
Keywords :
II-VI semiconductors; cadmium compounds; electric properties; electron backscattering; grain growth; grain size; photovoltaic effects; sputter deposition; thin films; twin boundaries; CdTe; EBSD; as-deposited films; deposition pressures; electrical performance; electrical property; electron backscatter diffraction; fiber textures; grain boundary structure; grain growth; grain size; grain texture; microstructure; photovoltaics; polycrystalline photovoltaic thin films; random high-angle boundary; twin boundary; weak axisymmetric textures; Films; Grain boundaries; Grain size; Indexing; Microstructure; Performance evaluation; Standards;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306331