DocumentCode :
576308
Title :
On-chip design techniques for reducing power supply noise effects on ADC with chip-PCB hierarchical structure
Author :
Bae, Bumhee ; Cho, Jonghyun ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
fYear :
2012
fDate :
6-10 Aug. 2012
Firstpage :
549
Lastpage :
553
Abstract :
In this paper, we propose the on-chip design techniques for controlling Power Supply Noise (PSN) effects on Analog-to-Digital Converter (ADC) with chip-Printed Circuit Board (PCB) hierarchical structure interconnected by bonding wires. There are two steps for explaining the proposed design technique. First, we explain what the PSN coupling path is on ADC. The PSN will couple from noise source to noise victim via power distribution network and circuit path. Second, we propose how we can reduce the noise coupling effects. The comparator is essential circuit to ADC and most sensitive circuit to PSN in ADC. Therefore, it is important to reduce the noise coupling effects on comparator for designing ADC which is non-sensitive to PSN. The comparator has two input nodes, and the differential voltage between two input nodes affect to ADC output. The impedance imbalance between two comparator inputs is the reason why the comparator is sensitive to PSN. So, the technique which is for balancing two input impedance is important to reduce PSN effects. We consider chip-PCB components to estimate two input impedance, because the two input impedances are affected by chip-PCB hierarchical structure. If we control the impedance of each input, we can design the ADC which is nonsensitive to PSN at the targeted frequency. We demonstrate the proposed technique based on simulation by PSN whose frequency swept from 1MHz to 3GHz.
Keywords :
analogue-digital conversion; comparators (circuits); integrated circuit interconnections; microprocessor chips; power supply circuits; printed circuits; ADC; PSN coupling path; analog-to-digital converter; bonding wires; chip-PCB hierarchical structure; comparator; impedance imbalance; interconnection; noise coupling effects; on-chip design; power distribution network; power supply noise effect control; printed circuit board; Bonding; Capacitors; Couplings; Impedance; Noise; System-on-a-chip; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on
Conference_Location :
Pittsburgh, PA
ISSN :
2158-110X
Print_ISBN :
978-1-4673-2061-0
Type :
conf
DOI :
10.1109/ISEMC.2012.6351672
Filename :
6351672
Link To Document :
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