• DocumentCode
    577288
  • Title

    Estimation of ground enhancing compound performance using Artificial Neural Network

  • Author

    Androvitsaneas, V.P. ; Asimakopoulou, F.E. ; Gonos, I.F. ; Stathopulos, I.A.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Athens, Greece
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    145
  • Lastpage
    149
  • Abstract
    Grounding system constitutes an essential part of the protection system of electrical installations and power systems against lightning and fault currents. Therefore, it is of paramount importance that engineers ensure as low values for grounding resistance as possible, during the designing phase as well as the lifecycle of the grounding system. A widely used technique of reducing the grounding resistance value, in case of high soil resistivity values, or lack of adequate space for the installation of grounding systems, is the use of ground enhancing compounds. This paper presents a methodology, for the evaluation of grounding resistance, under various meteorological conditions, of grounding systems embedded in natural soil as well as in ground enhancing compounds, using Artificial Neural Network (ANN). The ANN training is based on field measurements that have been performed in Greece during the last year. As a matter of fact, this is a first step to develop a new method for estimating variations of grounding resistance value.
  • Keywords
    earthing; electrical installation; fault currents; lightning protection; neural nets; power engineering computing; Greece; artificial neural network; electrical installations; fault currents; ground enhancing compound performance; grounding resistance; grounding system; high soil resistivity values; lightning protection; meteorological conditions; power systems; Artificial neural networks; Compounds; Conductivity; Grounding; Neurons; Resistance; Soil;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Voltage Engineering and Application (ICHVE), 2012 International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4673-4747-1
  • Type

    conf

  • DOI
    10.1109/ICHVE.2012.6357068
  • Filename
    6357068