Title :
Treeing resistance parameters of polymeric dielectrics
Author :
Gefle, O.S. ; Lebedev, S.M.
Author_Institution :
Physics Institute of High Technology of National Research Tomsk Polytechnic University 2A Lenin Avenue, 634028, Tomsk, Russia
Abstract :
Treeing resistance parameters for polystyrene, polymethyl methacrylate, and polycarbonate are presented in this paper. It has been shown that for polymers with residual mechanical strain the greatest treeing resistance is observed for samples with higher tensile yield strength. To decrease the treeing growth rate or increase the breakdown time of polymeric dielectrics, the thermal diffusivity of base polymers should be reduced.
Keywords :
dielectric materials; electric resistance; internal stresses; organic insulating materials; polymers; thermal diffusivity; trees (electrical); yield strength; base polymers; polycarbonate; polymeric dielectrics; polymethyl methacrylate; polystyrene; residual mechanical strain; tensile yield strength; thermal diffusivity; treeing growth rate; treeing resistance parameters; Injection molding; Interference; Needles; Partial discharges; Plastics; Strain; Treeing resistance; breakdown time; polymeric dielectrics; residual strain; thermal diffusivity;
Conference_Titel :
Strategic Technology (IFOST), 2012 7th International Forum on
Conference_Location :
Tomsk
Print_ISBN :
978-1-4673-1772-6
DOI :
10.1109/IFOST.2012.6357759
