Treeing resistance parameters of polymeric dielectrics

Author

Gefle, O.S. ; Lebedev, S.M.

Author_Institution

Physics Institute of High Technology of National Research Tomsk Polytechnic University 2A Lenin Avenue, 634028, Tomsk, Russia

fYear

2012

fDate

18-21 Sept. 2012

Firstpage

1

Lastpage

6

Abstract

Treeing resistance parameters for polystyrene, polymethyl methacrylate, and polycarbonate are presented in this paper. It has been shown that for polymers with residual mechanical strain the greatest treeing resistance is observed for samples with higher tensile yield strength. To decrease the treeing growth rate or increase the breakdown time of polymeric dielectrics, the thermal diffusivity of base polymers should be reduced.

Keywords

dielectric materials; electric resistance; internal stresses; organic insulating materials; polymers; thermal diffusivity; trees (electrical); yield strength; base polymers; polycarbonate; polymeric dielectrics; polymethyl methacrylate; polystyrene; residual mechanical strain; tensile yield strength; thermal diffusivity; treeing growth rate; treeing resistance parameters; Injection molding; Interference; Needles; Partial discharges; Plastics; Strain; Treeing resistance; breakdown time; polymeric dielectrics; residual strain; thermal diffusivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Strategic Technology (IFOST), 2012 7th International Forum on

Conference_Location

Tomsk

Print_ISBN

978-1-4673-1772-6

Type

conf

DOI

10.1109/IFOST.2012.6357759

Filename

6357759