DocumentCode
577823
Title
Data-based fault-tolerant control of the semiconductor manufacturing process based on K-nearest neighbor nonparametric regression
Author
Luo, Ming ; Zheng, Ying ; Liu, Shujie
Author_Institution
Dept. of Control Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2012
fDate
6-8 July 2012
Firstpage
3008
Lastpage
3012
Abstract
Run-to-run (R2R) control is the most commonly method in semiconductor manufacturing process. Generally, it is based on mathematical model, but for the complexity of the practical manufacturing process, it is difficult to set up the mechanical process model. This paper presents a data-based fault tolerant approach. Taking the disturbance and the fault into account, it adopts a large amount of historical data to predict the output of the single-product and multi-products semiconductor manufacturing process by the K-nearest neighbor (K-NN) nonparametric regression method. Then fault detection is achieved and a alarm is given, furthermore the traditional exponent weight moving average (EWMA) controller is improved to achieve fault-tolerant control. The results of simulation show that the approach is effective.
Keywords
fault diagnosis; fault tolerance; manufacturing processes; moving average processes; process control; regression analysis; semiconductor industry; EWMA controller; K-NN nonparametric regression method; R2R control; data-based fault-tolerant control approach; exponent weight moving average controller; fault detection; k-nearest neighbor nonparametric regression; mechanical process model; multiproduct semiconductor manufacturing process; run-to-run control; single-product semiconductor manufacturing process; Databases; Fault tolerance; Fault tolerant systems; Manufacturing processes; Mathematical model; Prediction algorithms; Vectors; EWMA; K-nearest neighbor; Non-parametric regression; Run-to-run control;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Control and Automation (WCICA), 2012 10th World Congress on
Conference_Location
Beijing
Print_ISBN
978-1-4673-1397-1
Type
conf
DOI
10.1109/WCICA.2012.6358387
Filename
6358387
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