DocumentCode
578497
Title
Fully integrated thermally actuated SOI diaphragm: Design, fabrication & characterization
Author
Lefevre, R. ; Salette, A. ; Montes, L. ; Morfouli, P. ; Dehan, C.
Author_Institution
LAHC, IMEP, Grenoble, France
fYear
2012
fDate
24-26 Sept. 2012
Firstpage
195
Lastpage
198
Abstract
This paper presents theoretical study and experimental results of fully integrated thermally actuated diaphragm. Finite element method (FEM) has been used to simulate and optimize the performance of the actuated diaphragm. It predicts the deflection behavior under definite power actuation and pressure. Heat transfer analysis is conducted to evaluate temperature field distribution. Some structures have been realized using IC compatible process on SOI wafers for high displacements under low driving power. The results show a difference lower than 4% between experiments under pressure and theoretical predictions.
Keywords
diaphragms; finite element analysis; heat transfer; microactuators; silicon-on-insulator; temperature distribution; FEM; IC compatible process; SOI wafers; deflection behavior; driving power; finite element method; fully integrated thermally actuated diaphragm; heat transfer analysis; power actuation; pressure; temperature field distribution; theoretical study; thermally actuated SOI diaphragm; Artificial intelligence; Finite element methods; Heating; Plasma measurements; FEM simulations; bimetallic; cleanroom fabrication; thermal and mechanical characterizations; ultra-thin diaphragm;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference Dresden-Grenoble (ISCDG), 2012 International
Conference_Location
Grenoble
Print_ISBN
978-1-4673-1717-7
Type
conf
DOI
10.1109/ISCDG.2012.6360021
Filename
6360021
Link To Document