DocumentCode :
578497
Title :
Fully integrated thermally actuated SOI diaphragm: Design, fabrication & characterization
Author :
Lefevre, R. ; Salette, A. ; Montes, L. ; Morfouli, P. ; Dehan, C.
Author_Institution :
LAHC, IMEP, Grenoble, France
fYear :
2012
fDate :
24-26 Sept. 2012
Firstpage :
195
Lastpage :
198
Abstract :
This paper presents theoretical study and experimental results of fully integrated thermally actuated diaphragm. Finite element method (FEM) has been used to simulate and optimize the performance of the actuated diaphragm. It predicts the deflection behavior under definite power actuation and pressure. Heat transfer analysis is conducted to evaluate temperature field distribution. Some structures have been realized using IC compatible process on SOI wafers for high displacements under low driving power. The results show a difference lower than 4% between experiments under pressure and theoretical predictions.
Keywords :
diaphragms; finite element analysis; heat transfer; microactuators; silicon-on-insulator; temperature distribution; FEM; IC compatible process; SOI wafers; deflection behavior; driving power; finite element method; fully integrated thermally actuated diaphragm; heat transfer analysis; power actuation; pressure; temperature field distribution; theoretical study; thermally actuated SOI diaphragm; Artificial intelligence; Finite element methods; Heating; Plasma measurements; FEM simulations; bimetallic; cleanroom fabrication; thermal and mechanical characterizations; ultra-thin diaphragm;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference Dresden-Grenoble (ISCDG), 2012 International
Conference_Location :
Grenoble
Print_ISBN :
978-1-4673-1717-7
Type :
conf
DOI :
10.1109/ISCDG.2012.6360021
Filename :
6360021
Link To Document :
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