• DocumentCode
    578497
  • Title

    Fully integrated thermally actuated SOI diaphragm: Design, fabrication & characterization

  • Author

    Lefevre, R. ; Salette, A. ; Montes, L. ; Morfouli, P. ; Dehan, C.

  • Author_Institution
    LAHC, IMEP, Grenoble, France
  • fYear
    2012
  • fDate
    24-26 Sept. 2012
  • Firstpage
    195
  • Lastpage
    198
  • Abstract
    This paper presents theoretical study and experimental results of fully integrated thermally actuated diaphragm. Finite element method (FEM) has been used to simulate and optimize the performance of the actuated diaphragm. It predicts the deflection behavior under definite power actuation and pressure. Heat transfer analysis is conducted to evaluate temperature field distribution. Some structures have been realized using IC compatible process on SOI wafers for high displacements under low driving power. The results show a difference lower than 4% between experiments under pressure and theoretical predictions.
  • Keywords
    diaphragms; finite element analysis; heat transfer; microactuators; silicon-on-insulator; temperature distribution; FEM; IC compatible process; SOI wafers; deflection behavior; driving power; finite element method; fully integrated thermally actuated diaphragm; heat transfer analysis; power actuation; pressure; temperature field distribution; theoretical study; thermally actuated SOI diaphragm; Artificial intelligence; Finite element methods; Heating; Plasma measurements; FEM simulations; bimetallic; cleanroom fabrication; thermal and mechanical characterizations; ultra-thin diaphragm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference Dresden-Grenoble (ISCDG), 2012 International
  • Conference_Location
    Grenoble
  • Print_ISBN
    978-1-4673-1717-7
  • Type

    conf

  • DOI
    10.1109/ISCDG.2012.6360021
  • Filename
    6360021