DocumentCode
578730
Title
Introducing immediate Carbon Footprint assessment to computer aided product design
Author
Chang, Hsiang-Tang ; Yang, Yu-Sheng
Author_Institution
Nat. Kaohsiung First Univ. of Sci. & Technol., Kaohsiung, Taiwan
fYear
2012
fDate
9-12 Sept. 2012
Firstpage
1
Lastpage
4
Abstract
The purpose of this research was to introduce a computer environmental assessment tool into computer aided product design. A new computer tool “CFE (Carbon Footprint Evaluator)” was developed due to the “Carbon Emission” issue. The proposed tool can assist a designer to monitor his new developing parts or products. The designer can directly obtain the carbon footprint information of a part or a product through inputting several data about the “material”, “assembly”, “sale and use”, and “recycling and disposal”, and their corresponding transportation, during constructing his 3-D CAD model. Originally, the authors planned to collect Taiwanese LCA data and related carbon emission regulations, and then make the proposed tool specifically helpful to Taiwanese industry. Restricted within the less Taiwanese carbon emission data, however, most of data was temporarily taken from the ecoinvent Cnetre´s ecoinvent data, Japanese LCA software “JEMAI-LCA Pro”, and Taiwanese government and academic research. Currently the proposed tool is still in improvement and development for function expansion.
Keywords
CAD; design for environment; process monitoring; product design; production engineering computing; recycling; 3D CAD model; CFE computer tool; JEMAI-LCA Pro; Japanese LCA software; Taiwanese LCA data collection; Taiwanese government; Taiwanese industry; academic research; assembly data; carbon emission regulations; carbon footprint assessment; carbon footprint evaluator; computer aided product design; computer environmental assessment tool; ecoinvent Cnetre ecoinvent data; material data; product monitoring; recycling-and-disposal data; sale-and-use data; Carbon; Carbon dioxide; Computers; Databases; Design automation; Monitoring; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Goes Green 2012+ (EGG), 2012
Conference_Location
Berlin
Print_ISBN
978-1-4673-4512-5
Electronic_ISBN
978-3-8396-0439-7
Type
conf
Filename
6360430
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