Title :
3D microelectronics: Teaching experience and research promising field
Author :
M´zah, Abir ; Hammami, Omar
Author_Institution :
ENSTA ParisTech., Paris, France
Abstract :
3D Design is not really a new technology; in fact the first ASIC design was designed in 1986. These last years, the interest in 3D is emerging to deal with the problem of the interconnect delay which is overcoming the gates delay in nanometer technologies. 3D ASIC design is facing industrial and academic challenges. We present in this work, the description of a 3D ASIC designs practical work teaching to students applying to the Master degree.
Keywords :
CMOS integrated circuits; application specific integrated circuits; electronic engineering education; integrated circuits; teaching; 3D ASIC design; Master degree; gate delay; interconnect delay; nanometer technology; research promising field; teaching experience; thee-dimensional microelectronics; Delay; Education; Electronic mail; Microelectronics; Solid modeling; System-on-a-chip; 3D Design; ASIC; challenges; teaching;
Conference_Titel :
Education and e-Learning Innovations (ICEELI), 2012 International Conference on
Conference_Location :
Sousse
Print_ISBN :
978-1-4673-2226-3
DOI :
10.1109/ICEELI.2012.6360580
