Title :
Mobile Sensor Monitoring System Using Modular Architecture Technology
Author :
Contreras, Mauricio ; Morales, Jorge ; Vera, Eduardo ; Cerda, Héctor ; Abarca, Luis
Author_Institution :
Center for Math. Modeling, Univ. of Chile, Santiago, Chile
Abstract :
Environmental monitoring is a key concern in underground mines, such as part of the copper mine of Codelco-Chile´s Andina Division, in the central part of the country. The concentration of dust is important due to its negative effect in workers health. Regrettably, sensors for this parameter are costly and therefore implementing a full scale monitoring network of static devices can be prohibitive. A feasible alternative is to use a mobile sensor/recorder. The problem is that analysis of the data can take place far apart in time with respect to the original measurement, preventing timely response. This paper describes work done jointly by Codelco-Chile and the Center for Mathematical Modeling (CMM) of the University of Chile (UChile), in order to create a prototype Mobile Monitoring Station (MMS), which will allow the creation of a complete environmental map of any area where a user can reach, at a fraction of the cost of implementing a full scale fixed monitoring network, in a near-real time mode. The key element in the solution is a hand held mobile device based on the BUG modular and open source prototyping platform.
Keywords :
air pollution; dust; environmental monitoring (geophysics); mining industry; occupational health; sensors; BUG modular platform; Center for Mathematical Modeling; Chile; Codelco; University of Chile; copper mine; dust concentration; environmental map; environmental monitoring; mobile recorder; mobile sensor monitoring system; modular architecture technology; open source prototyping platform; underground mine; worker health; Current measurement; Mobile communication; Monitoring; Prototypes; Software; Wireless communication; Wireless sensor networks;
Conference_Titel :
Information and Telecommunication Technologies (APSITT), 2012 9th Asia-Pacific Symposium on
Conference_Location :
Santiago and Valparaiso
Print_ISBN :
978-1-4673-2434-2