DocumentCode
581005
Title
Multi-scale, multi-physics analysis for device, chip, package, and board level
Author
Chew, Weng C.
Author_Institution
Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
fYear
2012
fDate
5-8 Nov. 2012
Firstpage
497
Lastpage
497
Abstract
Summary form only given. The computer integrated circuitmn (IC) is inundated with electromagnetic signals. These signals are omnipresent at the device, chip, package, and board level. The length-scales vary from nanometers to centimeters. The physics also changes significantly over these length-scales. It is clear that multi-scale, multi-physics analyses are needed to understand future generation IC´s.
Keywords
integrated circuit packaging; network analysis; board level; computer integrated circuitmn; device chip packaging; electromagnetic signal; future generation IC; multiscale multiphysics analysis; Electric breakdown; Electromagnetic fields; Equations; Integrated circuits; Mathematical model; Physics;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design (ICCAD), 2012 IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Type
conf
Filename
6386713
Link To Document