Co-simulations of electromagnetic and thermal effects in electronic circuits using non-conformal numerical methods

Advances in interconnect technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for higher functionality and superior performance while reducing size, power, and cost in today´s integrated circuits and package products. With the increase of clock frequency and edge rates as well as the continuously downscaling of feature size and 3-D interconnect technologies in high-speed systems, signal integrity (SI) effects such as signal delay, reflection, attenuation, dispersion and crosstalk have become one of the dominant factors in current deep sub-micrometer CMOS technologies limiting overall performance of high-speed systems.