Title :
A Highly Scalable Butterfly-Based Photonic Network-on-Chip
Author :
Wang, Junhui ; Li, Baoliang ; Feng, Quanyou ; Dou, Wenhua
Author_Institution :
Sch. of Comput., Nat. Univ. of Defense Technol., Changsha, China
Abstract :
Future chip multiprocessors will requires low-power, high performance on-chip networks. Photonic interconnects is a promising way to leverage silicon photonics for future CMPs. In this paper, we present a highly scalable BPNoC(butterfly-based photonic NoC). The most important feature of our proposed network is that it can scale to a more large size with acceptable performance by utilizing the characteristics of butterfly topology and basic photonic switching element (PSE2x2). BPNoC is a hierarchical network with an optical sub-network and an electrical sub-network. Optical sub-network with a load-balanced routing algorithm use circuit-based switching to transmit data packets, while the electronic sub-network with improved turn-around algorithm is based on packet-switching for control and data packet transmission. Finally, we analyze the optical loss, power consumption, and network performance for 64-core BPNoC under various synthetic traffic patterns. The results show that our proposed network has much low optical loss, good performance, and high energy efficiency.
Keywords :
integrated optics; multiprocessing systems; network routing; network-on-chip; 64-core BPNoC; BPNoC; CMP; chip multiprocessors; circuit-based switching; data packet transmission; electrical subnetwork; high performance on-chip networks; highly scalable butterfly-based photonic network-on-chip; load-balanced routing algorithm; optical subnetwork; photonic interconnects; photonic switching element; silicon photonics; turn-around algorithm; Optical fiber networks; Optical losses; Optical packet switching; Optical switches; Photonics; Power demand; NoC; butterfly; low-loss; photonic; scalable;
Conference_Titel :
Computer and Information Technology (CIT), 2012 IEEE 12th International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4673-4873-7
DOI :
10.1109/CIT.2012.31