Title :
AC resistance of copper clad aluminum wires
Author :
Ning Guan ; Kamidaki, Chihiro ; Shinmoto, T. ; Yashiro, K.
Author_Institution :
Power & Telecomm. Cable Syst. R&D Center, Fujikura Ltd., Sakura, Japan
fDate :
Oct. 29 2012-Nov. 2 2012
Abstract :
We have numerically analyzed the AC resistance caused by the skin and proximity effects for a circular wire. It is experimentally and theoretically demonstrated that CCA wires have lower resistance than Cu ones at some circumstances. The CCA wires will be very useful in power transfer systems because they are light-weight, cost-effective and even low-loss.
Keywords :
aluminium; copper; numerical analysis; skin effect; wires (electric); AC resistance; CCA wires; Cu-Al; copper clad aluminum wires; numerical analysis; power transfer systems; proximity effects; skin effect; Aluminum; Coils; Conductivity; Copper; Resistance; Skin; Wires;
Conference_Titel :
Antennas and Propagation (ISAP), 2012 International Symposium on
Conference_Location :
Nagoys
Print_ISBN :
978-1-4673-1001-7
