Title :
The EMI characteristics of High Speed backplane connector
Author :
Zhang Li ; Pingfang Yu ; Chua Chee-Parng
Author_Institution :
EMC & Lightning Protection Design Dept., Huawei Technol. Co., Ltd., Shenzhen, China
Abstract :
High Speed connector has played a critical role in data transfer from IC, through a channel to the receiving end. As industry constantly has an insatiable desire for high data rate, this pushed signal rise time and clock speed to be faster and faster. European CE conformity requirements have required wider measurement bandwidth, from 30MHz-1GHz to 30MHz-6GHz. Radiated emission characteristics of a high speed connector in a channel are of interest, because its component size now approaches the effective radiating length of λ/4. This paper focuses on high frequency radiation mechanism and radiation affecting factors for a generic backplane connector. Techniques to suppress connector radiated emissions are also suggested in this paper.
Keywords :
electric connectors; electromagnetic interference; high-speed integrated circuits; EMI; European CE conformity; clock speed; connector radiated emissions; data transfer; electromagnetic interference; frequency 30 MHz to 6 GHz; high frequency radiation mechanism and; high speed backplane connector; integrated circuits; signal rise time; Backplanes; Electromagnetic compatibility; Electromagnetic interference; Inductance; Materials; Pins; Backplane; EMC; EMI; High Frequency; High-Speed Connector; Radiated Emission;
Conference_Titel :
Electromagnetic Compatibility (EMC EUROPE), 2012 International Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4673-0718-5
DOI :
10.1109/EMCEurope.2012.6396882