A scalable electrical characterization method for inter-strata interconnects in 3-D ICs

Author

Xia, Tian ; Wang, Guoan

Author_Institution

Sch. of Eng., Univ. of Vermont, Burlington, VT, USA

fYear

2012

fDate

12-14 Sept. 2012

Firstpage

312

Lastpage

316

Abstract

This paper presents an analytical modeling method for characterizing the vertical interconnects in 3D ICs. In the model, all interconnection components, including micro-bump, TSV and RDL are firstly characterized with the frequency dependent skin effect into consideration. Then the scalable interconnect ABCD matrices are developed. The component´s dimensional effects on electrical properties, such as insertion loss, interconnect delay and input impedance are investigated.

Keywords

integrated circuit interconnections; integrated circuit modelling; skin effect; three-dimensional integrated circuits; 3D IC; ABCD matrices interconnection; RDL; TSV; component dimensional effects; electrical properties; frequency dependent skin effect; interconnection components; interstrata interconnects; microbump; scalable electrical characterization method; vertical interconnects; Capacitance; Impedance; Insertion loss; Integrated circuit interconnections; Integrated circuit modeling; Resonant frequency; Through-silicon vias; 3D ICs; TSV; interconnect; model; scalable;

fLanguage

English

Publisher

ieee

Conference_Titel

SOC Conference (SOCC), 2012 IEEE International

Conference_Location

Niagara Falls, NY

ISSN

2164-1676

Print_ISBN

978-1-4673-1294-3

Type

conf

DOI

10.1109/SOCC.2012.6398328

Filename

6398328