A highly modular LTCC packaging technology for Ka-band satellite systems

The complexity of today´s satellite systems is evergrowing and system weight and size of the subcomponents are becoming even more critical as the number of channels increases. A possible solution for achieving small systems, while maintaining reliability, is the use of the LTCC process. The packaging technology presented in this paper implies a modular concept, i.e. the system consists of a number of small, hermetically sealed LTCC modules connected on a carrier substrate. The module buildup, as well as the interconnections and external interfaces are discussed in detail.