Title :
Thermal aware design methodology for small signal discrete products
Author :
Holland, Steffen ; Rover, Martin ; Kuhl, H. ; Witt, H. ; Quade, R.
Author_Institution :
NXP Semicond., Hamburg, Germany
Abstract :
A methodology for electro-thermal simulations of discrete semiconductor devices on PCB level is presented. By combining the finite element simulation tools FloTherm and Sentaurus the computation time can be reduced so that it is possible to include the surrounding ambient into the electrothermal model. This is achieved by extraction of thermal resistances using FloTherm which are inserted into Sentaurus as thermal boundary conditions. This approach has been verified with thermal measurements for a set of discrete devices in different packages and PCB layouts. The simulation results agree well with measurement.
Keywords :
electronic engineering computing; finite element analysis; printed circuit layout; semiconductor device measurement; semiconductor device packaging; thermal management (packaging); thermal resistance; FloTherm; PCB layout; PCB level; Sentaurus; discrete device; discrete semiconductor device; electro-thermal simulation; electrothermal model; finite element simulation tool; small signal discrete product; thermal aware design methodology; thermal boundary condition; thermal measurement; thermal resistance; Computational modeling; Copper; Current measurement; Heat sinks; Semiconductor device measurement; Temperature measurement; Voltage measurement;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-1-4673-1882-2
