Title :
Quasi — 3D approach for BGA package thermal modeling
Author :
Petrosyants, K.O. ; Rjabov, N.I.
Author_Institution :
Moscow State Inst. of Electron. & Math. (Tech. Univ.), Moscow, Russia
Abstract :
The quasi-3D BGA package thermal model is proposed. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distribution in different layers of BGA package construction. It is shown that quasi-3D model provides the reasonable accuracy for standard and thermally enhanced BGAs. The software tool OVERHEAT-BGA is developed to obtain an numerical solution with considerably (6-10 times) reduced CPU time in comparison with universal 3D simulators. The good agreement between designed and measured temperatures for standard and XP BGA packages is achieved.
Keywords :
ball grid arrays; electronic engineering computing; heat transfer; multiprocessing systems; software packages; software tools; solid modelling; 2D equations; CPU time reduction; OVERHEAT-BGA; XP BGA package construction; ball grid array; general 3D heat transfer problem; numerical solution; quasi3D BGA package thermal model; software tool; temperature distribution; temperatures measured; thermally enhanced BGA; universal 3D simulators; Electronic packaging thermal management; Heating; Materials; Mathematical model; Numerical models; Standards; Temperature distribution;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-1-4673-1882-2
