DocumentCode
586540
Title
Drawing the packaging landscape for CFL applications
Author
Sluijs, F.J. ; Janssen, J.H.J. ; de Bruin, E.P.B.J. ; Dijkstra, Peter
fYear
2012
fDate
25-27 Sept. 2012
Firstpage
1
Lastpage
5
Abstract
In CFL lighting applications one of the main topics to address is the thermal situation of the driver electronics. With a relative high local ambient temperature the package for the CFL driver IC needs to be optimal designed for cost, size and thermal behavior. For the CFL application a compact thermal model was made and thermal measurements were done, showing a clear relation between used package technology and maximum CFL output power. The results can be used for optimal co-design of new CFL IC´s and their packages.
Keywords
packaging; CFL driver IC; CFL lighting application; compact thermal model; driver electronics; local ambient temperature; maximum CFL output power; package technology; packaging landscape; thermal behavior; thermal measurement; Electronic packaging thermal management; Electronics packaging; Furnaces; Integrated circuit modeling; Power generation; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-1-4673-1882-2
Type
conf
Filename
6400627
Link To Document