Title :
Minimizing thermally induced interfacial shearing stress in a thermoelectric module
Author :
Ziabari, Amirkoushyar ; Suhir, E. ; Shakouri, Ali
Author_Institution :
Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN, USA
Abstract :
The problem of minimizing the level of the thermally induced interfacial shearing stress in a Thermo-Electric Module (TEM) is addressed using analytical and finite-element-analysis (FEA) based modeling. The maximum stress is calculated for different leg sizes. Good agreement between the analytical and FEA predictions has been found. It is concluded that the shearing stress can be effectively minimized by using thinner legs with compliant interfaces.
Keywords :
finite element analysis; modules; shear deformation; thermal stresses; thermoelectric devices; FEA; TEM; analytical analysis; deformation; finite-element-analysis; leg size; thermally induced interfacial shearing stress minimizing; thermoelectric module; Analytical models; Assembly; Finite element methods; Materials; Shearing; Stress; Thermal stresses;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-1-4673-1882-2
