System integration using silicon-based integrated passive device technology

Author

Liguo Sun ; Yinchao Chen ; Kunquan Sun

Author_Institution

Dept. of Electron. Eng. & Inf. Sci., Univ. of Sci. & Technol. of China, Hefei, China

fYear

2012

fDate

21-23 Nov. 2012

Firstpage

98

Lastpage

100

Abstract

In this paper, the system on chip (SOC) and system in package (SiP) are discussed as two main approaches for system integration. The system on package (SOP) is introduced with the discussion of the integrated passive device (IPD). IPD based on silicon with high resistance is investigated and the SOP using silicon-based IPD is analyzed. It is found that the silicon-based IPD is a good candidate for the system integration, especially in radio frequency (RF) applications.

Keywords

elemental semiconductors; silicon; system-on-chip; system-on-package; IPD; RF application; SOC; Si; SiP; radio frequency application; silicon-based integrated passive device technology; system integration; system-in-package; system-on-chip; Packaging; Performance evaluation; Radio frequency; Resistance; Silicon; Substrates; System-on-a-chip; integrated passive device; radio frequency; silicon-based; system in package; system integration; system on chip; system on package;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio-Frequency Integration Technology (RFIT), 2012 IEEE International Symposium on

Conference_Location

Singapore

Print_ISBN

978-1-4673-2303-1

Type

conf

DOI

10.1109/RFIT.2012.6401626

Filename

6401626