Title :
System integration using silicon-based integrated passive device technology
Author :
Liguo Sun ; Yinchao Chen ; Kunquan Sun
Author_Institution :
Dept. of Electron. Eng. & Inf. Sci., Univ. of Sci. & Technol. of China, Hefei, China
Abstract :
In this paper, the system on chip (SOC) and system in package (SiP) are discussed as two main approaches for system integration. The system on package (SOP) is introduced with the discussion of the integrated passive device (IPD). IPD based on silicon with high resistance is investigated and the SOP using silicon-based IPD is analyzed. It is found that the silicon-based IPD is a good candidate for the system integration, especially in radio frequency (RF) applications.
Keywords :
elemental semiconductors; silicon; system-on-chip; system-on-package; IPD; RF application; SOC; Si; SiP; radio frequency application; silicon-based integrated passive device technology; system integration; system-in-package; system-on-chip; Packaging; Performance evaluation; Radio frequency; Resistance; Silicon; Substrates; System-on-a-chip; integrated passive device; radio frequency; silicon-based; system in package; system integration; system on chip; system on package;
Conference_Titel :
Radio-Frequency Integration Technology (RFIT), 2012 IEEE International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-2303-1
DOI :
10.1109/RFIT.2012.6401626
