DocumentCode
588138
Title
High mobility p-n junction-less InGaAs-OI tri-gate nMOSFETs with metal source/drain for ultra-low-power CMOS applications
Author
Irisawa, T. ; Oda, Masaomi ; Ikeda, Ken-ichi ; Moriyama, Y. ; Mieda, E. ; Jevasuwan, W. ; Maeda, T. ; Ichikawa, Osamu ; Ishihara, Takuya ; Hata, Masaharu ; Tezuka, Taro
Author_Institution
Collaborative Res. Team Green Nanoelectron. Center (GNC), AIST, Tsukuba, Japan
fYear
2012
fDate
1-4 Oct. 2012
Firstpage
1
Lastpage
2
Abstract
We have successfully fabricated InGaAs-OI tri-gate nMOSFETs, for the first time. The devices were depletion-type (p-n junction-less) nFETs with Fin-channel width (Wfin) down to 20 nm and had metal source/drain structures. It was experimentally demonstrated that Wfin scaling effectively improved cut-off properties at Nd up to 5 × 1018 cm-3 and the electron mobility in the narrowest channel (Wfin = 20 nm) was about 3x higher than that of the inversion layer. It was also demonstrated that enhancement of In content from 53% to 70% leaded to 30% Ion enhancement without Ioff degradation.
Keywords
CMOS integrated circuits; III-V semiconductors; MOSFET; electron mobility; gallium arsenide; indium compounds; low-power electronics; InGaAs-OI; depletion-type nFET; electron mobility; fin-channel width; high mobility p-n junction-less trigate nMOSFET; metal source-drain structures; size 20 nm; ultralow-power CMOS applications; Degradation; Indium gallium arsenide; Logic gates; MOSFETs; Metals; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference (SOI), 2012 IEEE International
Conference_Location
NAPA, CA
ISSN
1078-621X
Print_ISBN
978-1-4673-2690-2
Electronic_ISBN
1078-621X
Type
conf
DOI
10.1109/SOI.2012.6404353
Filename
6404353
Link To Document