A Finite Element Simulation of the Propagation Properties Shear Surface Acoustic Wave Devices

Author

Pei Cao ; Jialin Zhu ; Xiaolin Huang ; Jingmin Gao

Author_Institution

Beijing Key Lab. for Sensor, Beijing Inf. Sci. & Technol. Univ., Beijing, China

Volume

2

fYear

2012

fDate

28-29 Oct. 2012

Firstpage

119

Lastpage

122

Abstract

In this paper, the propagation properties of Love wave are analyzed from the wave equation of Love wave. According to the condition of generating Love wave, the model using ST-90°X quartz wafer as substrate and SiO₂ as overlay is simulated by ANSYS finite element software. The various velocities are calculated by the data of various modes, then the diagram of the velocity and frequency is drawn using the Lagrange interpolation function, which can prove the dispersion characteristics of Love wave. The Love wave device with 83MHz center frequency is designed according to the relationship between velocity and frequency, and its insertion loss is 10dB. The velocity of Love wave at 83MHz is calculated as 4922m/s according to the period of Interdigital transducer (IDT) and the amplitude-frequency characteristics measured by network analyzer, which is consistent with the simulation results.

Keywords

Love waves; acoustic wave propagation; finite element analysis; interdigital transducers; quartz; silicon compounds; surface acoustic wave devices; ANSYS finite element software; IDT; Lagrange interpolation function; Love wave generation conditions; Love wave propagation properties; ST-90°X quartz wafer substrate; SiO2 overlay; amplitude-frequency characteristics; finite element simulation; frequency 83 MHz; interdigital transducer; network analyzer; shear SAW device propagation properties; surface acoustic waves; velocity 4922 m/s; velocity-frequency diagram; wave equation; Acoustic waves; Finite element methods; Mathematical model; Propagation; Semiconductor device modeling; Substrates; Surface acoustic wave devices; ANSYS simulation; Love wave; ST-90°X quartz wafer; propagation properties; shear SAW;

fLanguage

English

Publisher

ieee

Conference_Titel

Computational Intelligence and Design (ISCID), 2012 Fifth International Symposium on

Conference_Location

Hangzhou

Print_ISBN

978-1-4673-2646-9

Type

conf

DOI

10.1109/ISCID.2012.182

Filename

6405581