DocumentCode
589499
Title
Perspectives on 3D ToF sensor SoC integration for user interface application
Author
Tae-Yon Lee ; Jung-Kyu Jung ; Dong-Ki Min ; Yoondong Park ; Kwanghyuk Bae ; Tae-Chan Kim
Author_Institution
Image Lab., Samsung Electron. Co., Ltd., Hwasung, South Korea
fYear
2012
fDate
4-7 Nov. 2012
Firstpage
309
Lastpage
312
Abstract
System-on-a-chip integration of three dimensional time-of-flight image sensor invokes several technical issues, which are different from the case of conventional two dimensional CMOS image sensor. In this paper, we review several technical issues with examples of several cases, and suggest solutions especially in view point of pixel design.
Keywords
CMOS image sensors; system-on-chip; three-dimensional integrated circuits; user interfaces; 3D ToF sensor SoC integration; Abstract-System-on-a-chip integration; pixel design view point; technical issues; three dimensional time-of-flight image sensor; two dimensional CMOS image sensor; user interface application; Demodulation; Frequency modulation; Image sensors; Light emitting diodes; Noise; System-on-a-chip; CMOS; image sensor; modulation; pixel; system-on-a-chip; three dimensional; time-of-flight;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2012 International
Conference_Location
Jeju Island
Print_ISBN
978-1-4673-2989-7
Electronic_ISBN
978-1-4673-2988-0
Type
conf
DOI
10.1109/ISOCC.2012.6407102
Filename
6407102
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