Title :
SPICE modelling of a valley switching flyback power supply controller for improved efficiency in low cost devices
Author :
Nambiar, Vishnu P. ; Yahya, A. ; Selvaduray, T.R.
Author_Institution :
Microelectron. & Comput. Eng. Dept., Univ. Teknol. Malaysia, Skudai, Malaysia
Abstract :
The flyback switching mode power supply (SMPS) circuit is undoubtedly the most popular topology currently in low power applications, due to its low cost and simple structure. In the past, there have been many proposed optimizations to flyback designs utilising various techniques such as zero voltage switching (ZVS), active clamping, synchronous rectification, and more. However, most of these designs complicate the original snubbed structure of the flyback topology, and increases its cost. This paper presents the evaluation of a variable-frequency, soft-switching, snubbed, DC/DC flyback converter that utilizes valley switching for improving efficiency. The flyback controller is modelled using SPICE, and uses pulse skipping to maintain the equilibrium of the system based on the feedback from the output. Simulation models report up to 92.2% efficiency, which is almost comparable to ZVS and active clamping topologies. The main advantage of this design is the use of only a single switching transistor, with no additional inductors, correctional circuitry, or clamping action, thus guaranteeing a low cost design.
Keywords :
DC-DC power convertors; SPICE; network topology; optimisation; power MOSFET; power supplies to apparatus; switching convertors; SMPS; SPICE modelling; ZVS; active clamping topologies; flyback topology snubbed structure; low cost design; low cost devices; low power applications; pulse skipping; single switching transistor; valley switching flyback power supply controller; variable-frequency soft-switching snubbed DC-DC flyback converter; Clamps; Integrated circuit modeling; MOSFETs; Pulse width modulation; SPICE; Switches; Zero voltage switching; Flyback; Pulse Skipping; SMPS; SPICE; Soft Switching; Valley Switching;
Conference_Titel :
Circuits and Systems (ICCAS), 2012 IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4673-3117-3
Electronic_ISBN :
978-1-4673-3118-0
DOI :
10.1109/ICCircuitsAndSystems.2012.6408340