• DocumentCode
    590457
  • Title

    Combined simulation-based correction factors for reluctances of planar coil substrates

  • Author

    Marschner, Uwe ; Yunpeng Feng ; Starke, Eric ; Sauer, Sebastian ; Fischer, Wolf-Joachim

  • Author_Institution
    Inst. for Semicond. & Microsyst., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A method and a simplified analytical expression are presented for the calculation of the effective reluctance of a magnetic substrate underneath a planar coil as parameter in a simplified electromechanical network model. The investigated magnetic substrates have a toroid geometry with rectangular cross section, different thicknesses and permeabilities. The method is based on a combined simulation of the magnetic quantities where network parameters are determined by a Finite Element simulation. A network transformation allows the computation of partial inductances which are related to the reluctances. Depending on thickness and permeability the effective substrate reluctance differs from a geometrically based reluctance calculation, where an axisymmetric field distribution without axial component is assumed. From the almost linear relation between the reluctances a correction factor can be given. This factor allows the simplified calculation of the effective reluctance of a magnetic substrate underneath a planar coil.
  • Keywords
    coils; electromagnetic devices; electromechanical effects; inductance; magnetic permeability; magnetic sensors; axisymmetric field distribution; correction factor; electromechanical network model; magnetic planar coil substrate; magnetic substrate underneath; partial inductance; permeability; reluctance; simulation-based correction factor; toroid geometry; Atmospheric modeling; Coils; Inductance; Magnetic flux; Magnetic separation; Substrates; Toroidal magnetic fields;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411263
  • Filename
    6411263