DocumentCode :
590508
Title :
Pressure dependence of thin polycrystalline silicon carbide diaphragm resonators
Author :
Barnes, A.C. ; Jaesung Lee ; Rawlinson, P.T. ; Feng, Philip X.-L ; Zorman, C.A.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
fYear :
2012
fDate :
28-31 Oct. 2012
Firstpage :
1
Lastpage :
4
Abstract :
Square poly cry stalline 3C silicon carbide (poly-SiC) thin diaphragms with large aspect ratios (i.e., side length to thickness: L/t ~ 600) are explored as a structural material for micromechanical resonators. The effects of varying pressure on the characteristics of multiple resonant modes are studied. Load-deflection tests reveal a Young´s modulus of EY = 344 ± 13 GPa and a residual (built-in) stress of σ0 = 113 ± 10 MPa. Cyclic loading tests of the diaphragms show no changes in EY and σ0 values after over 30,000 cycles. Resonance measurements of the diaphragms at approximately 5mTorr show peaks with quality (Q) factors of Q´s ≈ 14,000 and 45,000 for the first two flexural resonance modes at 85.5kHz and 137.6kHz. With increasing pressure, the measured resonance frequencies shift higher (i.e., stiffening), by approximately 1.7kHz or 1.9% for the 85.5kHz peak, and 1.8kHz or 1.3% for the 137.6kHz peak. Meanwhile, Q´s are observed to decrease to ~400 at 20Torr for the 85.5kHz resonance and to ~3600 at 2Torr for the 137.6kHz resonance. Simultaneously as the pressure increases, the peak amplitude of the resonance reduces by 97% for the mode at 85.5kHz, and by 93% for the 137.6kHz resonance. These characteristics may be exploited for resonant pressure sensing using poly-SiC.
Keywords :
micromechanical resonators; pressure sensors; silicon compounds; wide band gap semiconductors; Young´s modulus; load-deflection tests; micromechanical resonators; multiple resonant modes; poly-SiC thin diaphragms; pressure dependence; resonant pressure sensing; structural material; thin polycrystalline silicon carbide diaphragm resonators; Frequency measurement; Pressure measurement; Q measurement; Resonant frequency; Silicon; Silicon carbide; Temperature measurement; Diaphragm; MEMS; NEMS; Poly-SiC; Pressure Sensor; Quality (Q) Factor; Resonator; Silicon Carbide (SiC);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2012 IEEE
Conference_Location :
Taipei
ISSN :
1930-0395
Print_ISBN :
978-1-4577-1766-6
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2012.6411366
Filename :
6411366
Link To Document :
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