• DocumentCode
    590531
  • Title

    High-frequency CMUT arrays with phase-steering for in vivo ultrasound imaging

  • Author

    Midtbo, K. ; Ronnekleiv, Arne ; Ingebrigtsen, K.A. ; Due-Hansen, J. ; Poppe, E. ; Wang, D.T. ; Jensen, Geir U. ; Schjolberg-Henriksen, K.

  • Author_Institution
    Dept. of Electron. & Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Capacitive micromachined ultrasonic transducers (CMUTs) have prospective clinical applications in ultrasound diagnostics and therapy. We have modeled, fabricated, and characterized CMUT arrays suitable for intravascular and gastrointestinal use. The elements of the CMUT arrays are connected from the back side of the array by through-silicon-vias (TSVs) with a pitch of 25 μm. In the reported work, the presence of TSVs does not reduce the fill factor of the array. Two different membrane designs were fabricated, resulting in a resonance frequency in air of 35.6 and 41.0 MHz, respectively. The measurements were in good agreement with the simulated performance. The realized devices are promising for the fabrication of a 3D-ready and bio-compatible device, suitable for in vivo ultrasound applications.
  • Keywords
    biomedical ultrasonics; capacitive sensors; cardiovascular system; elemental semiconductors; membranes; micromachining; microsensors; patient diagnosis; silicon; three-dimensional integrated circuits; ultrasonic imaging; ultrasonic transducer arrays; CMUT array; TSV; capacitive micromachined ultrasonic transducer; clinical application; fill factor; frequency 35.6 MHz; frequency 41.0 MHz; gastrointestinal use; in vivo ultrasound imaging; intravascular; membrane design; phase steering; size 25 mum; through silicon vias; ultrasound diagnostics; ultrasound therapy; Biomembranes; Cavity resonators; Fabrication; Frequency measurement; Resonant frequency; Through-silicon vias; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411413
  • Filename
    6411413