DocumentCode :
590548
Title :
Thin-film-based thermoelectric energy generator device with a card structure
Author :
Xiao Yu ; Yanxiang Liu ; Tie Li ; Hong Zhou ; Xiuli Gao ; Fei Feng ; Yuelin Wang
Author_Institution :
State Key Lab. of Transducer Technol. & the Sci. & Technol. on Micro-Syst. Lab., Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
fYear :
2012
fDate :
28-31 Oct. 2012
Firstpage :
1
Lastpage :
4
Abstract :
This work presents a thermoelectric energy generator (TEG) device with a card structure which embeds a thin-film based TEG chip. The thermocouples are densely arranged between comb-shaped substrates in the chip. The chip is packaged vertically and heated/cooled by metallic plugs connected with the external heat source and heat sink. The packaged device has a footprint of 3 mm × 1.2 mm, while the height can be flexibly scaled by changing the dimensions of the metallic plugs, which indicates a potential use in the high density electronic devices. The n/p poly-silicon is employed as the thermoelectric material for the early-stage research of the new TEG structure. The measured open-circuit voltage for each TEG card reaches 110 mV·K-1. Being worn on human body, the output power on a matched external load reached 0.13 μW for 3 cards in parallel, which improves more than two orders of magnitude than traditional in-plane packaged TEG device with poly-silicon thermal legs.
Keywords :
elemental semiconductors; heat sinks; silicon; thermocouples; thin films; Si; card structure; comb-shaped substrates; external heat source; heat sink; high density electronic devices; metallic plugs; packaged device; polysilicon thermal legs; thermocouples; thermoelectric material; thin-film-based thermoelectric energy generator; Copper; Generators; Heat sinks; Materials; Power generation; Temperature measurement; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2012 IEEE
Conference_Location :
Taipei
ISSN :
1930-0395
Print_ISBN :
978-1-4577-1766-6
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2012.6411445
Filename :
6411445
Link To Document :
بازگشت