DocumentCode :
590552
Title :
Fabrication and electrical characterization of bottom-up silicon nanowire resonators
Author :
Sansa, M. ; Paulo, A.S. ; Perez-Murano, F.
Author_Institution :
CNM, IMB, UAB, Bellaterra, Spain
fYear :
2012
fDate :
28-31 Oct. 2012
Firstpage :
1
Lastpage :
4
Abstract :
We present the fabrication and electrical characterization of nanomechanical resonators based on bottom-up grown silicon nanowires. The high piezoresistance coefficients of these nanowires provide an intrinsic transduction mechanism with good performance at high frequencies. We have characterized the frequency response of double clamped silicon nanowires with diameters of less than 100 nm. In particular, we have studied the first and second resonance modes, at frequencies higher than 190 MHz. We have observed the splitting of each resonance mode in two orthogonal vibration modes, which is attributed to the break-down of the axial symmetry of the nanowires. This effect can be used to improve the mass sensing performance of the devices.
Keywords :
elemental semiconductors; micromechanical resonators; nanowires; piezoresistance; silicon; Si; bottom-up silicon nanowire resonator fabrication; electrical characterization; high piezoresistance coefficient; intrinsic transduction mechanism; mass sensing; orthogonal vibration mode; resonance mode; Frequency measurement; Frequency modulation; Frequency response; Nanobioscience; Resonant frequency; Sensors; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2012 IEEE
Conference_Location :
Taipei
ISSN :
1930-0395
Print_ISBN :
978-1-4577-1766-6
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2012.6411456
Filename :
6411456
Link To Document :
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