DocumentCode
59126
Title
Performance Enhancements of Flip-Chip Light-Emitting Diodes With High-Density n-Type Point-Contacts
Author
Wing Cheung Chong ; Kei May Lau
Author_Institution
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
Volume
35
Issue
10
fYear
2014
fDate
Oct. 2014
Firstpage
1049
Lastpage
1051
Abstract
Novel gallium nitride-based flip-chip light-emitting diodes (FCLEDs) with high-density distributed n-type point-contacts were designed and fabricated. With high density and uniformly distributed n-type point-contacts, the point-contact (PC) FCLEDs had higher light output power (LOP) by 18% over the reference flip-chip LED with conventional contacts fabricated from the same wafer. The forward voltage of the PC-FCLEDs was 0.16 V lower than the reference FCLED and the wall-plug efficiency was increased by 24% at the same current level. The maximum LOP of the PC-FCLEDs measured at 2.4 A was 43% more than the maximum obtained by the reference LED at 1.8 A. It was also found that the PC-FCLEDs suffered lower efficiency droop. The optical performance improvement of the PC-FCLEDs is attributed to an increase of the light extraction and the uniform carrier distribution, which results from the small and high density deeply etched holes and PCs. The electrical performance was enhanced through a minimized lateral current spreading distance.
Keywords
III-V semiconductors; flip-chip devices; gallium compounds; light emitting diodes; point contacts; wide band gap semiconductors; GaN; PC FCLED; conventional contacts; current 1.8 A; current 2.4 A; current level; efficiency droop; flip-chip light-emitting diodes; forward voltage; gallium nitride-based FCLED; high-density deeply-etched holes; high-density distributed n-type point-contacts; light extraction; light output power; minimized lateral current spreading distance; reference flip-chip LED; uniform carrier distribution; uniformly-distributed n-type point-contacts; wall-plug efficiency; Conductivity; Electrodes; Gallium nitride; Light emitting diodes; Metals; Power generation; Substrates; Flip-chip; gallium nitride (GaN); light-emitting diodes (LEDs); point-contact (PC); point-contact flip-chip LED (PC-FCLED);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2014.2349956
Filename
6894119
Link To Document