DocumentCode :
591428
Title :
Delay metric for on-chip RLCG interconnect for arbitrary input
Author :
Maheshwari, V. ; Jadav, H. ; Majumdar, Shreyan ; Rakshit, J. ; Kar, Rajib ; Mandal, Durbadal
Author_Institution :
Deptt. of ECE, Apeejay Stya Univ., Gurgaon, India
fYear :
2012
fDate :
28-29 Dec. 2012
Firstpage :
369
Lastpage :
372
Abstract :
In order to accurately model high frequency effects inductance had been taken into consideration. Earlier only the delay caused due to the presence of gates was considered to be an important issue, but now with decreasing feature size and increasing complexity ,on chip interconnect delay has acquired prominence for incremental performance-driven layout synthesis. We develop a novel analytical delay model, for RLCG interconnect lines that in addition to preserving the effectiveness of previous RLCG interconnect models, improves the accuracy for deep submicron technologies that are used at higher frequencies. In this paper we have put forward an analytical model, which could accurately capture the on chip interconnect delay. We develop a novel analytical model based on the first and second moments of the interconnect transfer function when the input is arbitrary signal. Delay estimate using our first moment based analytical model is within 3% of SPICE-computed delay, and model based on first two moments is within 2% of SPICE, across a wide range of interconnects parameter values.
Keywords :
delays; integrated circuit interconnections; integrated circuit modelling; SPICE; analytical delay model; delay metric; on-chip RLCG interconnect; Decision support systems; Delay; Impedance; Intelligent systems; Load modeling; Mercury (metals); Arbitrary Input; Delay Calculation; Moment Matching; RLCG Interconnect;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications, Devices and Intelligent Systems (CODIS), 2012 International Conference on
Conference_Location :
Kolkata
Print_ISBN :
978-1-4673-4699-3
Type :
conf
DOI :
10.1109/CODIS.2012.6422215
Filename :
6422215
Link To Document :
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