• DocumentCode
    592120
  • Title

    Self Similar Cubic: A Novel Interconnection Network for Many-Core Architectures

  • Author

    Slo-Li Chu ; Geng-Siao Lee ; Yan-Wun Peng

  • Author_Institution
    Dept. of Inf. & Comput. Eng., Chung Yuan Christian Univ., Chungli, Taiwan
  • fYear
    2012
  • fDate
    17-20 Dec. 2012
  • Firstpage
    303
  • Lastpage
    310
  • Abstract
    The continuous improving of semiconductor technology integrates more processors into a single chip. While integrate multiple processors into a chip, the interconnection network of among the cores become a dominant performance bottleneck. Accordingly, this paper provides a new on-chip interconnection network, called Self Similar Cubic (SSC), for many-core architectures. By cooperating with proposed linking mechanism, routing algorithm, and switching architectures, SSC has better scalability, on-chip fabrication possibility, and high communication performance, than conventional on-chip networks, such as Mesh, and Hypercube. In this paper, the comparison of performance and area cost are proposed. The analysis results reveal that SSC can provide higher throughput and lower area cost than other on-chip networks. The performance per area cost of SSC is five times better than that of Mesh.
  • Keywords
    computer architecture; microprocessor chips; monolithic integrated circuits; multiprocessing systems; multiprocessor interconnection networks; network routing; SSC; linking mechanism; manycore architecture; multiprocessor chip; on-chip interconnection network; routing algorithm; self similar cubic; semiconductor technology; switching architecture; Hypercubes; Joining processes; Network topology; Switches; System-on-a-chip; Topology; Interconnection Network; Many-Core Architecture; Network-on-Chip; Planner Topology; Self Similar Cubic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel Architectures, Algorithms and Programming (PAAP), 2012 Fifth International Symposium on
  • Conference_Location
    Taipei
  • ISSN
    2168-3034
  • Print_ISBN
    978-1-4673-4566-8
  • Type

    conf

  • DOI
    10.1109/PAAP.2012.49
  • Filename
    6424771