• DocumentCode
    59363
  • Title

    Endurance/Retention Trade-off on \\hbox {HfO}_{2}/\\hbox {M\\etal} Cap 1T1R Bipolar RRAM

  • Author

    Yang Yin Chen ; Goux, L. ; Clima, S. ; Govoreanu, B. ; Degraeve, Robin ; Kar, Gouri Sankar ; Fantini, Andrea ; Groeseneken, Guido ; Wouters, D.J. ; Jurczak, Malgorzata

  • Author_Institution
    IMEC, Leuven, Belgium
  • Volume
    60
  • Issue
    3
  • fYear
    2013
  • fDate
    Mar-13
  • Firstpage
    1114
  • Lastpage
    1121
  • Abstract
    The endurance/retention performance of HfO2/ Metal cap RRAM devices in a 1T1R configuration shows metal cap dependence. For Hf and Ti caps, owning strong thermodynamic ability of extracting oxygen from HfO2, long pulse endurance (>1010 cycles) could be achieved. For Ta cap, owning lower thermodynamic ability of extracting oxygen from HfO2, better retention can be achieved. Therefore, an endurance/retention performance tradeoff is identified on the 40 nm × 40 nm HfO2/Metal cap bipolar RRAM devices. The tradeoff of endurance/retention performance can be explained by a different filament constriction shape depending on metal cap layer as derived from fitting I-V curves in the quantum point contact model. This difference in filament constriction shape is attributed to the thermodynamics difference of metal cap: Hf and Ti have a stronger thermodynamical ability to extract oxygen from HfO2 than Ta. The possibility of tuning the intrinsic reliability performance by changing the cap materials paves a way for optimizing the operation of RRAM devices into the desired specifics.
  • Keywords
    bipolar memory circuits; curve fitting; hafnium; hafnium compounds; integrated circuit reliability; random-access storage; tantalum; thermodynamics; titanium; HfO2; I-V curve fitting; Ta; Ti; endurance-retention trade-off; filament constriction shape; hafnium oxide-metal cap 1T1R bipolar RRAM devices; intrinsic reliability performance; metal cap dependence; metal cap layer; oxygen extraction; pulse endurance; quantum point contact model; tantalum cap; thermodynamic ability; thermodynamic difference; titanium cap; Hafnium compounds; Materials; Resistance; Switches; Transistors; $hbox{HfO}_{2}$; Endurance; filament shape; quantum point conductance (QPC); resistive switching memory (RRAM); retention; thermodynamics;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2241064
  • Filename
    6463440