Electrical interconnect design for testing of high-speed IC transceivers

Author

Rimolo-Donadio, Renato ; Baks, Christian ; Lee, Byeong ; Song, Jong Hyun ; Gu, Xingfa ; Kwark, Young H. ; Kuchta, D.M. ; Rylyakov, A.V. ; Schow, C.L.

Author_Institution

IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

2012

fDate

21-24 Oct. 2012

Firstpage

55

Lastpage

58

Abstract

This paper discusses the requirements and challenges associated with the design of electrical interconnects to support the test and evaluation of high-speed transceivers working up to 40 Gb/s. It will be shown that relatively low cost technologies such as FR-4 boards, push-on connectors, and wire bonding can effectively achieve this goal. A specific platform and its application for testing of a 40-Gb/s VCSEL-based optoelectronic link are presented.

Keywords

high-speed integrated circuits; integrated optoelectronics; optical interconnections; optical testing; optical transceivers; surface emitting lasers; FR-4 boards; VCSEL-based optoelectronic link; bit rate 40 Gbit/s; electrical interconnect design; high-speed IC transceiver testing; push-on connectors; wire bonding; Connectors; Integrated circuits; Optical fiber communication; Optical transmitters; Probes; Transceivers; Wires; interconnects; power integrity; printed circuit board; short-reach link; signal integrity; wire bond;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on

Conference_Location

Tempe, AZ

Print_ISBN

978-1-4673-2539-4

Electronic_ISBN

978-1-4673-2537-0

Type

conf

DOI

10.1109/EPEPS.2012.6457842

Filename

6457842