DocumentCode :
594045
Title :
Frequency- and time-domain stochastic analysis of lossy and dispersive interconnects in a SPICE-like environment
Author :
Manfredi, Paolo ; Ginste, Dries Vande ; De Zutter, Daniel ; Canavero, Flavio G.
Author_Institution :
Dipt. di Elettron. e Telecomun., Politec. di Torino, Turin, Italy
fYear :
2012
fDate :
21-24 Oct. 2012
Firstpage :
65
Lastpage :
68
Abstract :
This paper presents an improvement of the state-of-the-art polynomial chaos (PC) modeling of high-speed interconnects with parameter uncertainties via SPICE-like tools. While the previous model, due to its mathematical formulation, was limited to lossless lines, the introduction of modified classes of polynomials yields a formulation that allows to account for lossess and dispersion as well. Thanks to this, the new implementation can also take full advantage of the combination of the PC technique with macromodels that accurately describe the interconnect properties. An application example, i.e. the stochastic analysis of an on-chip line, validates and demonstrates the improved method.
Keywords :
SPICE; chaos; circuit simulation; frequency-domain analysis; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; polynomials; stochastic processes; time-domain analysis; PC modeling; PC technique; SPICE-like environment; SPICE-like tool; dispersive interconnects; frequency-domain stochastic analysis; high-speed interconnects; interconnect properties; lossless line; lossy interconnects; macromodel; mathematical formulation; on-chip line; parameter uncertainties; polynomial chaos modeling; time-domain stochastic analysis; Dispersion; Integrated circuit interconnections; Polynomials; Stochastic processes; Symmetric matrices; System-on-a-chip; Transmission line matrix methods; Circuit modeling; circuit simulation; polynomial chaos; stochastic analysis; tolerance analysis; transmission lines; uncertainty;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
Type :
conf
DOI :
10.1109/EPEPS.2012.6457844
Filename :
6457844
Link To Document :
بازگشت