Title :
Electrical performance of via transitions in the presence of overlapping anti-pads
Author :
Kostka, Darryl ; Scogna, A.C. ; Jianmin Zhang ; Qiu, K. ; Brooks, Richard
Author_Institution :
CST of America Inc., Framingham, MA, USA
Abstract :
The electrical performance of vias in multilayer PCBs is investigated. In particular the resonance effect due to overlapping anti-pads is characterized and an analytical formulation based on the dimensions of the cavity formed by the anti-pads and the vias is used to predict such a resonance. A prototype board is fabricated and measured results confirm the predicted results obtained from 3D electromagnetic simulation.
Keywords :
printed circuit design; 3D electromagnetic simulation; electrical performance; multilayer PCB; overlapping anti-pads; resonance effect; Cavity resonators; Correlation; Impedance; Insertion loss; Mathematical model; Resonant frequency; Solid modeling; PCB; Vias; anti-pads; high speed; signal integrity;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
DOI :
10.1109/EPEPS.2012.6457852
