Title :
Embedded toroidal magnetic coupling probe in multi-layer PCBs for current measurement
Author :
Kim, Jonghoon J. ; Heegon Kim ; Sunkyu Kong ; Jung, Daniel H. ; Joungho Kim ; Jiseong Kim ; Hajin Sung
Author_Institution :
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
Abstract :
The importance of current detection has been highlighted with the introduction of 3D-IC, in order to ensure the safe and reliable operation of analog circuits in mixed-signal systems. In this paper, we propose toroidal current probe embedded in multi-layer printed circuit boards (PCBs) for current detection. Current is magnetically coupled to the proposed current probe and the transfer impedance between the port of injected current and the proposed current probe is used for the analysis of current coupling and current reconstruction. Through time- and frequency-domain experimental measurements with test vehicles on multilayer PCBs, we verified that the proposed current probe can accurately detect current signals. The proposed current probe does not influence the original current path, yet achieves high accuracy with a compact size by using a toroidal array of vias that surrounds the current path.
Keywords :
analogue integrated circuits; electric current measurement; frequency-domain analysis; mixed analogue-digital integrated circuits; printed circuits; probes; three-dimensional integrated circuits; time-domain analysis; 3D-IC; analog circuits; current coupling; current detection; current measurement; current path; current reconstruction; current signals; embedded toroidal magnetic coupling probe; frequency-domain experimental measurements; injected current; mixed-signal systems; multilayer PCB; multilayer printed circuit boards; test vehicles; time-domain experimental measurements; toroidal array; toroidal current probe; transfer impedance; Clocks; Current measurement; Frequency domain analysis; Integrated circuit modeling; Probes; Vehicles; current probing; inductive coupling; signal reconstruction;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
DOI :
10.1109/EPEPS.2012.6457866