DocumentCode
594060
Title
A partial homomorphic encryption scheme for secure design automation on public clouds
Author
Yu, Anbo ; Sathanur, Arun V. ; Jandhyala, Vikram
Author_Institution
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
fYear
2012
fDate
21-24 Oct. 2012
Firstpage
177
Lastpage
180
Abstract
The massive compute power offered by public clouds such as Amazon Web Services EC2 provides for a new paradigm in cost-effective and highly scalable parallel deployment of Electronic Design Automation (EDA) tools. Even though the advantages are myriad, customers perceive an inherent security risk in exposing their IP to the cloud. In this work, we start by outlining the shortcomings of established encryption techniques for use in public machines. Using the example of electromagnetic simulation, we show how the IP (layout and technology) may be reverse-engineered from the Green´s function matrix by utilizing the Multi Dimensional Scaling approach. We then propose encryption schemes to defeat such sophisticated hacking attempts using principles of homomorphic encryption, while enabling scalability and computational benefits of public clouds.
Keywords
Green´s function methods; IP networks; cloud computing; computer network security; cryptography; electronic design automation; matrix algebra; reverse engineering; risk analysis; EDA tools; Green´s function matrix; computational benefits; electromagnetic simulation; hacking attempts; highly scalable parallel deployment; homomorphic encryption; multidimensional scaling approach; partial homomorphic encryption scheme; public clouds computational benefits; public machines; reverse engineering; secure design automation; security risk; Cloud computing; Encryption; Green´s function methods; IP networks; Layout; Matrix decomposition; Moment methods; Cloud computing; Electromagnetic simulation; Electronic Design Automation; Field solver; Green´s function; Homomorphic encryption; Matrix completion; Method of Moments; Multi Dimensional Scaling; Singular Values;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location
Tempe, AZ
Print_ISBN
978-1-4673-2539-4
Electronic_ISBN
978-1-4673-2537-0
Type
conf
DOI
10.1109/EPEPS.2012.6457871
Filename
6457871
Link To Document