DocumentCode :
594063
Title :
Novel technology for power and signal integrity using a metal particle conductive layer
Author :
Sasaoka, Naoto ; Ochi, Takao ; Oono, Masato ; Ueda, Chihiro ; Akiyama, Yoko ; Otsuka, Kanji
Author_Institution :
Nippon Kodoshi Corp., Kochi, Japan
fYear :
2012
fDate :
21-24 Oct. 2012
Firstpage :
244
Lastpage :
247
Abstract :
Recently, power integrity (PI) has been the most important technological issue in the field of electronic circuits and systems and has been addressed in important papers using several different approaches [1][2]. The latest concept of the best PI condition is a low impedance between the power and ground lines or planes that can be maintained regardless of the clock frequency, even in the GHz region. This concept was mentioned in a relatively old book [3] from the 1980s, so it is not the newest idea. However, this condition cannot be completely realized using several of the previously proposed approaches, including many involving the use of low-inductance capacitances. We are aware that the electromagnetic interference (EMI) problems of plane power/ground resonance are induced because of the resonance caused by eddy currents or multiple reflections of voltage fluctuations. A novel technology was used in our previous study in which a conductive layer of dispersed metal particles was used instead of a copper plane [4][5]. This structure improved the PI for any clock frequency, particularly in the GHz region, with an impedance of less than 1 Ω. In this study, we examine the electromagnetic wave transmission data in order to investigate the different physical phenomena, and we present some fundamental data on PI and signal integrity (SI). The results indicate that the use of a transmission line with a metal particle conductive layer can yield various changes in the electromagnetic wave transmission speed, such as an increase of 76% or a decrease of 21%. The Z11 values of the power/GND plane test coupon were from 1.8 to 3.0 Ω in the frequency region from 5 to 20 GHz. These results suggest that the metal particle conductive layer has useful characteristics for improving the PI and SI.
Keywords :
electromagnetic interference; electromagnetic wave transmission; EMI problem; electromagnetic interference problem; electromagnetic wave transmission; electronic circuit; frequency 5 GHz to 20 GHz; ground resonance; low-inductance capacitance; metal particle conductive layer; power integrity; power resonance; resistance 1.8 ohm to 3 ohm; signal integrity; transmission line; voltage fluctuation; Dielectric constant; Metals; Power transmission lines; Silicon; Surface waves; Transmission line measurements; impedance; power integrity; signal integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
Type :
conf
DOI :
10.1109/EPEPS.2012.6457887
Filename :
6457887
Link To Document :
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