DocumentCode
594067
Title
Hybrid modeling method for transient simulation of multilayered power/ground planes
Author
Watanabe, Toshio
Author_Institution
Grad. Sch. of Manage. & Inf. of Innovation, Univ. of Shizuoka, Shizuoka, Japan
fYear
2012
fDate
21-24 Oct. 2012
Firstpage
288
Lastpage
291
Abstract
The power integrity is one of the serious problem in the design of three-dimensional integrated circuits and packaging. Usually, the board and interposer carrying them have multilayered power/ground plane, which plays an important role in the power distribution network (PDN) of the system. Therefore, the modeling and simulation of multilayered power/ground planes become increasingly important.
Keywords
three-dimensional integrated circuits; 3D integrated circuits; hybrid modeling method; interposer; multilayered power/ground planes; packaging; power distribution network; power integrity; transient simulation; Equivalent circuits; Hidden Markov models; Hybrid power systems; Integrated circuit modeling; Load modeling; Standards; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location
Tempe, AZ
Print_ISBN
978-1-4673-2539-4
Electronic_ISBN
978-1-4673-2537-0
Type
conf
DOI
10.1109/EPEPS.2012.6457898
Filename
6457898
Link To Document