Vertical interconnect modeling between GCPWs in LTCC technology

Author

Pavan, C.L.N. ; Raju, K. C. James

Author_Institution

Sch. of Phys., Univ. of Hyderabad, Hyderabad, India

fYear

2012

fDate

5-7 Dec. 2012

Firstpage

211

Lastpage

213

Abstract

In this paper, vertical via interconnects between Grounded Coplanar Waveguide (GCPW) transmission lines in Low Temperature Cofired Ceramic (LTCC) Technology has been simulated for realization at C-MET, Pune. The S-parameters of the overall structure have been computed. A parametric study has been performed by varying via parameters like via diameter, via height and the resulting performance has been analyzed. An equivalent lumped element model for vias has been shown and the corresponding model parameters are extracted. The insertion loss is observed to be better than 0.4 dB and return loss is below -14 dB up to 10 GHz frequency.

Keywords

S-parameters; coplanar waveguides; interconnections; transmission lines; GCPW transmission lines; LTCC technology; S-parameters; equivalent lumped element model; grounded coplanar waveguide; insertion loss; low temperature cofired ceramic technology; vertical interconnect modeling; Computational modeling; Conductors; Coplanar waveguides; Educational institutions; Integrated circuit interconnections; Microwave circuits; Substrates; GCPW; LTCC; Vertical Interconnects and 3D-IC;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Electronics (PrimeAsia), 2012 Asia Pacific Conference on Postgraduate Research in

Conference_Location

Hyderabad

ISSN

2159-2144

Print_ISBN

978-1-4673-5065-5

Type

conf

DOI

10.1109/PrimeAsia.2012.6458656

Filename

6458656