Title :
Mode suppressing packaging for 50 GHz cryogenic low-noise amplifiers
Author :
Henke, Daniel ; Jiang, Frank ; Claude, Stephane
Author_Institution :
NRC Herzberg Inst. of Astrophys., Victoria, BC, Canada
fDate :
Oct. 29 2012-Nov. 1 2012
Abstract :
Hybrid cryogenic low-noise amplifiers are often enclosed in a metallic housing with several bias channels. Strict machining tolerance is necessary for solid clamping of the lid to avoid degradation in performance. A new packaging is proposed by applying photonic bandgap (PBG) structures; which greatly relaxes the tolerance on clamping, results in natural bias channels, suppresses higher order modes, and creates wide open access for assembly.
Keywords :
cryogenic electronics; electronics packaging; low noise amplifiers; millimetre wave amplifiers; photonic band gap; PBG structures; frequency 50 GHz; higher order mode suppression; hybrid cryogenic low-noise amplifiers; metallic housing; mode suppressing packaging; natural bias channels; photonic bandgap structures; solid clamping; strict machining tolerance; Assembly; Connectors; Cryogenics; Microstrip; Microwave photonics; Packaging; Substrates; Low-noise amplifiers; microwave amplifiers; millimeter wave devices; packaging; periodic structures; photonic bandgap (PBG);
Conference_Titel :
Microwave Conference (EuMC), 2012 42nd European
Conference_Location :
Amsterdam
Print_ISBN :
978-1-4673-2215-7
Electronic_ISBN :
978-2-87487-026-2
